摘要
开发可阳离子光聚合的氟硅单体是光聚合领域重要的研究方向。利用易得的原料和简单的工艺合成了一种氟硅缩水甘油醚环氧单体(FSi-GE),采用核磁共振波谱仪(NMR)和傅立叶变换红外光谱仪(FT-IR)对该单体的结构进行了表征,并研究了其对环氧单体3,4-环氧环己基甲基3,4-环氧环己基甲酸酯(E4221)和1,2-环氧−4-乙烯基环己烷(VOH)组成的阳离子光聚合体系的光聚合动力学、表面疏水性、耐热性及拉伸性能的影响。结果表明:当FSi-GE的添加量从0增加到0.5%,体系的环氧基团最终转化率从60.6%上升到65.7%,固化膜表面水接触角从56.9°升至104.6°,断裂伸长率从22.96%升至41.22%,同时耐热性提高。但随着FSi-GE的含量继续增加,表面水接触角、耐热性和断裂伸长率都呈现略微下降的趋势。说明加入适量的FSi-GE能够有效提高E4221/VOH体系的最终转化率、疏水性、耐热性和机械性能。
Developing cationic photopolymerizable fluorosilicone monomers is one of the important research directions in the field of photopolymerization.A fluorosilicone glycidyl ether epoxy monomer(FSi-GE)was synthesized by using readily available raw materials and simple synthesis process,and the monomer structure was characterized using NMR and FT-IR.The influence of FSi-GE on polymerization kinetics,surface water resistance,heat resistance and tensile properties of the cationic photopolymerization system comprised of 3,4-epoxy-cyclohexyl methyl 3,4-epoxy-cyclohexyl formate(E4221)and 1,2-epoxy-4-vinylcyclohexane(VOH)was investigated.The results showed that when FSi-GE amount was increased from 0 to 0.5%,the final conversion of epoxy group of the system was increased from 60.6%to 65.7%,the surface water contact angle was increased from 56.9°to 104.6°,the elongation at break was increased from 22.96%to 41.22%,and the heat resistance was also improved.However,with the further increase of FSi-GE amount,the surface water contact angle,heat resistance and elongation at break presented a slightly decreasing,which indicated that the appropriate FSi-GE amount could effectively improve the final conversion,hydrophobicity,heat resistance and mechanical properties of E4221/VOH system.
作者
王烁天
胡韵朗
贾伟
聂俊
孙芳
Wang Shuotian;Hu Yunlang;Jia Wei;Nie Jun;Sun Fang(Beijing University of Chemical Technology,Beijing 100029,China;Anqing Research Institute,Beijing University of Chemical Technology,Anqing,Anhui 246000,China)
出处
《涂料工业》
CAS
CSCD
北大核心
2024年第2期1-6,共6页
Paint & Coatings Industry
基金
国家自然科学基金(52073018)。
关键词
阳离子光聚合
氟硅单体
缩水甘油醚环氧单体
cationic photopolymerization
fluorosilicone monomer
glycidyl ether epoxy monomer