一种高压压合的高频PCB层偏改善研究

Research on a high-frequency PCB layer deviation improvement with high-pressure pressing

对一种结构为“芯板+半固化片(PP)+芯板”的4层高频印制电路板(PCB)进行研究,鉴于其PP流动性较低,采用高压的方式压合,会导致严重的层间偏移问题。通过不同的排板方式,包括PIN钉定位压合工艺(PIN+LAM)、电磁热熔+PIN和铆钉+PIN 3种方法,研究不同排板方式对层偏的影响,结合层偏数据从原理上对不同的排板方式进行分析论证,为改善类似PCB层偏问题提供理论支持。

The main research object of this paper is a four-layer high-frequency printed circuit board(PCB)with the structure of "core board +prepreg(PP)+ core board".In view of its low PP fluidity,the high-pressure pressing will lead to serious layer deviation problem.Different plate arrangement methods are adopted,including PIN+LAM,electromagnetic hot melt +PIN,rivet +PIN.This paper studies the influence of different plate arrangement methods on the alignment between layers,and analyzes the different plate arrangement methods based on the layer deviation data,so as to provide theoretical support for improving the similar PCB layer deviation problem.