热界面用导热绝缘陶瓷填料的研究进展

Research Progress in Thermally-conductive and Insulating Ceramic Fillers for Thermal Interface

兼具高导热和绝缘性的热界面材料是支撑电气设备高效运行,提升其使用寿命的重要基础材料。热界面材料以高分子聚合物为基体,因而其本征导热性能差;通过添加高导热的绝缘陶瓷填料,构建三维导热网络,可以极大地提升聚合物基复合材料的导热性能。综述了近年来氧化物、氮化物、碳化物以及陶瓷复合填料的研究现状及存在的问题,同时展望了今后高导热陶瓷填料的发展方向与研究重点。

Thermal interface materials with high thermal conductivity and insulation are important materials to support the efficient operation of electrical equipment and improve their service life.Polymer-based thermal interface materials have a poor intrinsic thermal conductivity.By adding insulating ceramic fillers with high thermal conductivity,a three-dimensional thermal network could be constructed to polymer matrix composites with greatly improved thermal conductivity.The research status and existing problems of oxides,nitrides,carbides and composite ceramic fillers in recent years,were summarize,while the future development direction and research focus of high thermal conductivity ceramic fillers are prospected.