Chiplet封装用有机基板的信号完整性设计

Signal Integrity Design of Organic Substrates for Chiplet Package

芯粒(Chiplet)技术带来了芯片规模、性能和成本的平衡,受到了业界和用户的高度关注。针对不同的Chiplet封装方案,对先进/标准封装方案中电气互连的参数与性能进行比较并解读。基于国内的有机基板工艺,从设计和仿真角度对Chiplet标准封装方案进行技术可行性研究。在合理的端接配置下,信号通道的性能可以达到UCIe的设计要求。结果表明,有机基板的低损耗、灵活布线等特性在一定程度上弥补了硅基板在互连密度和能效方面的短板。该研究为Chiplet通用协议的国产应用转化以及Chiplet封装设计提供了参考。

Chiplet technology brings a balance of chip size,performance and cost,and has received much attention from the industry and users.For different Chiplet package schemes,the parameters and performance of electrical interconnections in advanced/standard package schemes are compared and interpreted.Based on the domestic organic substrate process,a technical feasibility study of Chiplet standard package scheme is conducted from the perspectives of design and simulation.With reasonable termination configurations,the performance of signal channels can meet the design requirements of UCIe.The results show that the characteristics of low-loss and flexible wiring of organic substrates make up to some extent for the shortcomings of silicon substrates in terms of interconnect density and energy efficiency.This study provides a reference for the translation of the Chiplet universal protocol for domestic applications and the design of Chiplet package.