Ag-Cu-Sn-Cr真空钎焊金刚石/铜合金接头微观组织与剪切强度

Microstructure and Shear Strength of Diamond/Cu Alloy Joint Brazed with Ag-Cu-Sn-Cr Filler Metal

采用Ag-Cu-Sn-Cr活性钎料,将金刚石膜片与铜合金进行了钎焊连接。研究分析了钎焊温度对连接接头微观组织及接头力学性能的影响。结果表明,钎料与金刚石的界面结合良好,钎料中的Cr与金刚石发生反应并在界面处形成Cr_(3)C_(2)碳化物。钎缝中心主要由Cu基固溶体、Ag基固溶体、Cu_(3)Sn金属间化合物和Cr组成。当钎焊温度在780~840℃范围时,随着温度的提高,界面反应层逐渐增厚,钎焊接头剪切强度先升高后降低。在最佳的钎焊温度820℃和保温时间15 min下,接头剪切强度达到最高值147 MPa。通过优化钎焊温度,成功实现了金刚石膜片与铜合金的可靠连接。该方法可为实际工业生产中硬脆材料与金属的连接提供新的思路与技术途径。

The diamond film was brazed with copper alloy using Ag-Cu-Sn-Cr active brazing material.The study analyzed the effect of brazing temperature on the microstructure and mechanical properties of the joint.The results indicate that the interface between the brazing material and diamond is well bonded,and Cr in the brazing material reacts with diamond to form Cr_(3)C_(2) carbides at the interface.The center of the brazing seam is mainly composed of Cu based solid solution,Ag based solid solution,Cu_(3)Sn intermetallic compound,and Cr.When the brazing temperature is in the range of 780~840℃,as the temperature increases,the interface reaction layer gradually thickens,and the shear strength of the brazed joint first increases and then decreases.At the optimal brazing temperature of 820℃ and holding time of 15 minutes,the maximum shear strength of the joint reached 147 MPa.By optimizing the brazing temperature,reliable connection between diamond film and copper alloy has been successfully achieved.This method can provide new ideas and technical approaches for the connection between hard and brittle materials and metals in actual industrial production.