钎料合金蠕变行为及非耦合型本构理论研究进展

Advances of Creep Behavior and Uncouple Constitutive Theory of Solder Alloy

在严苛的服役环境与小型化结构设计需求的双重作用下,航天仪器设备所承受的载荷不断增加并愈加复杂,而焊点、引线等封装结构作为仪器设备的薄弱环节,一旦破坏往往会导致器件甚至设备功能丧失,为了提升仪器设备的环境适应性与可靠性,需要准确把握封装结构材料蠕变行为与损伤机理,完善钎料合金本构理论并提升材料蠕变性能预测精度,发展封装结构精细化仿真分析方法。本文梳理了钎料合金蠕变性能及其影响因素,回顾了非耦合型本构理论的发展历程与研究热点,分析了相关模型的预测能力,为深入理解钎料合金蠕变行为与性能预测奠定基础。

As the miniaturization design of aerospace instruments,the instruments service in a tough environment with more and more complex loading.Solder joints,lead and other package structure is the weak link and the consequence of its failure is very serious,which may cause device damages.In order to improve the environmental adaptability and reliability of the package structures,the materials properties of solder alloy and the constitutive model should be investigated.In this paper,the investigation status of creep properties and uncouple constitutive model in recent years were reviewed comprehensively.Prediction capabilities of different constitutive models were discussed in details,which was beneficial for understanding of creep behavior of solder alloy.