微晶氧化铝在薄壁陶瓷封装外壳上的应用

Application of Microcrystalline Alumina in Thin-Wall Ceramic Shell

氧化铝陶瓷封装外壳的薄壁化有利于提升散热能力并降低外壳重量,但薄壁化在实际应用中存在可靠性隐患,尤其是在航空航天等严苛工况条件下。普遍认为氧化铝的强度和气密性是解决薄壁陶瓷封装外壳可靠性难题的关键,为解决这个难题,自主研发了微晶氧化铝陶瓷,并对陶瓷的抗弯强度和气密性进行了测试,以此设计为依据,采用微晶氧化铝制备出了外形尺寸1.6 mm×1.2 mm、壁厚0.15 mm的薄壁陶瓷封装外壳,可靠性验证合格,满足了新型电子器件的应用需求。

The thin-walling of alumina ceramic packaging shell is beneficial for improving heat dissipation capacity and reducing shell weight,but there are reliability risks in practical applications,especially in harsh working conditions for example the aerospace.It is generally believed that the strength and airtightness of alumina are crucial to solve the reliability problem of thin-wall ceramic packaging shells.Microcrystalline alumina ceramics are independently developed,and the bending strength and airtightness of the ceramics are tested.By using the microcrystalline alumina ceramics,a thin-wall ceramic packaging shell with overall dimension of 1.6 mm×1.2 mm and a wall thickness of 0.15 mm is prepared.It passes the reliability verification and meets the application requirements of new electronic devices.