塑封基板类器件翻新件无损鉴别方法研究

Research on Nondestructive Identification Methods for the Refurbished Parts of Plastic Packaging Substrate Devices

本研究提出了一种针对塑封基板类翻新件的无损鉴别方法。通过外观特征分析、声学扫描电子显微镜分析和X射线分析等技术方法,实现了塑封基板类翻新件的无损鉴别方法。结合相关案例,揭示了塑封基板类器件的典型翻新物理特征,有效指导了塑封基板类翻新器件的鉴别方向。针对典型翻新物理特征进行综合评价和风险分级,进一步加强了塑封基板类器件在应用过程中的风险规避。

This study proposes a non-destructive identification method for refurbished parts of plastic packaging substrates.Through technical methods such as appearance feature analysis,X-ray analysis and acoustic scanning electron microscopy analysis,non-destructive identification of refurbished plastic packaging substrate components has been achieved.Combined with relevant cases,the typical refurbishment physical characteristics of plastic encapsulated substrate devices were revealed,effectively guiding the identification direction of plastic encapsulated substrate refurbished devices.Comprehensive evaluation and risk classification were conducted for typical refurbished physical features,further strengthening risk avoidance in the application process.