面向回流焊工艺过程质量控制的温度场仿真技术研究

Temperature field simulation technology for research in quality control of the reflow process

针对回流焊工艺过程中的质量控制问题,文章提出了一种创新的回流焊温度场仿真方法。该方法综合考虑热对流和热辐射的影响,以单温区炉腔作为回流炉,PCB组件作为被焊物体,借助Ansys Icepak软件模拟回流焊接过程,并搭建炉温测试平台用于监控PCB组件温度曲线,以分析其焊接质量。结果表明,仿真模型成功模拟了工艺参数组A~C的回流温度分布。仿真与实测温度曲线吻合较好,其中工艺参数组A实现了更高的焊接质量。文章提出的创新方法能够顺利实现回流焊工艺过程的质量控制,得到合理的回流温度曲线,为优化回流焊工艺提供了理论依据,有助于快速调整工艺参数以提高焊接质量和生产效率;同时该方法也可为其他类似工艺的温度场控制提供参考。

This study proposes an innovative simulation method to address quality control issues in the reflow soldering process by analyzing the temperature field.The method considers the influences of thermal convection and thermal radiation,utilizing a single-temperature chamber as the reflow oven and PCB components as the soldered objects.Ansys Icepak software is employed to simulate the reflow soldering process,and an oven temperature test platform is built to monitor the temperature profiles of PCB components,facilitating quality analysis of soldering.The simulation model effectively replicates the reflow temperature distribution among different process parameter groups(A to C),consistently matching the measured temperature profiles.Notably,process parameter group A yields superior solder quality.This innovative approach achieves effective quality control,providing a theoretical foundation for optimizing the reflow soldering process and facilitating adjustments to enhance both soldering performance and productivity.Furthermore,it offers valuable insights for controlling temperature fields in similar processes,making it a valuable reference for various manufacturing applications in the electronics industry.