高性能芯片物理实现的关键因素

Key factors in the physical design of high-performance chips

影响高性能芯片的物理设计涉及多个关键因素,文章分析了其中主要的5个因素:标准单元库、核心IP库、布局布线、制造工艺、物理设计与EDA工具/Foundry的协作优化.通过对基本情况介绍,当前行业情况分析等,剖析了影响高性能芯片设计及制造的核心因素,对高性能芯片未来需要重点发展的方向提出了一些探讨思路.

The physical design of high-performance chips is influenced by multiple critical factors.This paper analyzes five main factors:standard cell library,intellectual property(IP)library,place and route,manufacturing process,and collaborative optimization of physical design with electronic design automation(EDA)tools/Foundry.Through an introduction to the fundamental aspects and an analysis of the current industry situation,this study explores the core elements that impact the design and manufacturing of high-performance chips.Furthermore,it provides insights into future directions that need to be emphasized in the development of high-performance chips.