一种20GHz0.65mm节距CQFP外壳

20 GHz 0.65 mm Pitch CQFP

提出了一种应用频率达20 GHz的0.65 mm节距陶瓷四边引线扁平封装(CQFP)外壳,对高频信号的传输采用共面波导-垂直过孔-共面波导-引线的结构。对成型引线附近的阻抗不连续性进行了分析,通过信号传输引线的非等宽设计,改善了引线部位的阻抗突变,提高了信号的传输带宽。通过板级联合仿真和布线优化,将外壳应用频率提升至20 GHz。利用GSG探针对外壳样品进行测试,实测结果表明,该结构在DC~20 GHz插入损耗优于-1 dB,回波损耗不大于-15 dB。该CQFP外壳通过了机械和环境可靠性试验,可应用于高频高可靠封装领域。

A 0.65 mm pitch ceramic quad lead flat package(CQFP)with an application frequency of 20 GHz was presented.A coplanar waveguide-vertical via-coplanar waveguide-lead structure was adopted for high frequency signal transmission.The impedance discontinuity near the formed lead was analyzed.Through the non-uniform width design of the signal transmission lead,the impedance mutation at the lead position was improved,and the signal transmission bandwidth was increased.Through board level joint simulation and routing optimization,the application frequency of the package was increased to 20 GHz.The GSG probe was used to test the package sample.The measurement results indicate that at DC-20 GHz,the insertion loss of the structure is better than-1 dB and the return loss is not more than-15 dB.The CQFP has passed mechanical and environmental reliability tests and can be used in high frequency and high reliability packaging fields.