互穿网络结构的二氧化硅/环氧树脂复合材料的制备及介电性能研究

Preparation of Silicon Dioxide/Epoxy Composites with Interpenetrating Network Structure and Research on Their Dielectric Properties

环氧树脂(EP)具有较高的电绝缘性能和较低的介电损耗,因此被广泛应用于电气设备和电子封装等绝缘材料领域。由于传统EP耐热性能较差、韧性不足,极大限制了其作为微电子元器件在高频电场下的使用。本工作以硅烷偶联剂(3-环氧乙基甲氧基丙基)三甲氧基硅烷(KH-560)和正硅酸乙酯(TEOS)为原料,通过溶胶-凝胶法合成末端含有环氧基团的新型端环氧基纳米SiO_(2)(E-SiO_(2)),用其对E-51型EP进行改性,在固化剂作用下使E-SiO_(2)和EP上的环氧基团发生开环反应,通过有机EP与无机E-SiO_(2)填料之间的化学键结合,制备出具有互穿网络结构的E-SiO_(2)/EP复合材料。本工作研究了添加E-SiO_(2)对EP固化反应工艺和综合性能的影响,以期在保证EP低介电常数和低介电损耗的同时,赋予其良好的韧性和耐热性能,为EP在高频电路下的应用奠定基础。

Epoxy resins(EP)are widely used in the field of electrical equipment and electronic packaging insulation materials,owning to their high electrical insulation performance and low dielectric loss.However,their low heat resistance and insufficient toughness had greatly limited their application in microelectronic components under high-frequency.Therefore,this work prepared a novel nano-SiO_(2)(E-SiO_(2))with terminal epoxy group via the sol-gel process,while the silane coupling agent KH-560 and TEOS were chosen as raw materials.The prepared E-SiO_(2) were then used as fillers to blend with EP(E-51).The ring opening reactions of epoxy groups on the E-SiO_(2) and EP were happened under the presence of curing agent,to obtain the E-SiO_(2)/EP composites with interpenetrating network structure which connected by chemical bond between organic EP and inorganic E-SiO_(2) fillers.The effects of E-SiO_(2) content on the curing reaction process and comprehensive performance of EP resin are also researched.This work is aiming to prepare a new kind of E-SiO_(2)/EP composites that can be used in high frequency circuit.