工程陶瓷引弧微爆炸加工边缘碎裂的周向包封研究

Study on Circumferential Wrapping of Edge Chipping During Engineering Ceramics Machined by MDSAM

针对工程陶瓷引弧微爆炸加工时的边缘碎裂现象,提出了一种利用低熔点金属周向包封施加预应力控制陶瓷材料加工边缘碎裂的方法。介绍了周向包封工艺,开展了包封后工件的引弧微爆炸加工实验,并通过有限元方法对工程陶瓷包封过程中的温度场及应力场进行了仿真,揭示了周向包封控制工程陶瓷引弧微爆炸加工边缘碎裂的机理。

Aiming at the edge chipping phenomenon during engineering ceramics machined by Micro-Detonation of Striking Arc Machining(MDSAM),a technology named circumferential wrapping applying pre-stress with low melting point metal is developed to reduce the edge chipping.The circumferential wrapping process was introduced,and the wrapped workpiece was machined by MDSAM.The temperature field and stress field during the wrapping process of engineering ceramics were simulated by FEM.The mechanism of circumferential wrapping to reduce the edge chipping during engineering ceramics machined by MDSAM was revealed.