CBGA器件基于界面空洞的失效模式分析

Failure Mode Analysis of CBGA Based on Interfacial Voids

随着航天产品国产化率的提升,陶瓷球栅阵列封装(CBGA)器件的应用越来越广泛,CBGA器件焊点具有多个界面,其失效模式也更为复杂。本文探究了某产品CBGA器件在应力筛选试验过程中的失效模式,发现空洞率并非是影响CBGA器件焊接可靠性的决定性因素,空洞在焊接界面的分布可能对可靠性的影响更大,空洞在焊点中存在的位置比尺寸大小更为关键,为提高CBGA器件的焊接可靠性提供新的方向。

With the improvement of the localization rate of aerospace products,Ceramic Ball Grid Array(CBGA)are applied more and more frequently.There are multiple interfaces in the solder joints of CBGA devices,and their failure modes are more complex.This paper explores the failure mode of a CBGA device in the stress screening test process,and finds that the voidage is not the decisive factor affecting the welding reliability of CBGA devices.The distribution of voids at the welding interface may have a greater impact on the reliability,and the location of voids in the solder joint is more critical than the size.It provides a new direction for improving the welding reliability of CBGA devices.