数据中心光模块技术及演进

Data Center Optical Module Technology and Its Evolution

算力需求提升带动网络带宽成倍增加,数据中心能耗呈指数型增长。针对低功耗、高带宽的技术需求,硅光、共封装光学(CPO)等技术有望成为长期解决方案。硅光芯片采用光互联,叠加CPO技术,将光引擎与交换芯片共同封装,在速率提高的同时大大缩减功耗。液冷技术、线性驱动可插拨光模块(LPO)、相干技术及薄膜铌酸锂等技术成为光模块优化主要新趋势。LPO在高线性度跨阻放大器(TIA)/驱动芯片厂商大力推动下或可快速落地。相干精简版解决方案在数据中心2km以内传输距离方面有竞争优势。

Network bandwith multiplies and power consumption of data centers increases exponentially.SiPh and co-package optics(CPO)may be long-term solutions around the technical requirements of low-power consumption and high-bandwidth.SiP chips can be optical in-terconnection.Using SiPh and CPO stacking techniques which can realize co-package of optical engines and switch chips,power consump-tion can be greatly reduced when transmission rate inreases.Besides,liquid cooling technology,linear-drive pluggable optics(LPO),coher-ent technology,and thin film lithium niobate will be main development trends of optical modules.LPO should be quick landing with vigorous promotion of high-linearity trans-impedance amplifier(TIA)/driver manufacturers.Coherent lite solution becomes competitive when solving under 2 km transmission in data centers.