高精度倒装焊机的光学对位系统

Optical Alignment System of Flip Chip Bonder with High Precision

红外焦平面探测器芯片的像元阵列规模不断扩大,像元尺寸不断减小,与读出电路基板的精确互连变得愈加困难,对用于互连工艺核心设备倒装焊机提出了更高的要求。为实现探测器芯片与读出电路基板的精确互连,通过分析倒装焊接工艺的流程,得出芯片与基板的调平和对准是关键环节。介绍了倒装焊机光学对位系统的组成,并对其准直光路系统、显微成像系统、激光测距系统进行了研究。

The pixel array size of IRFPA detector chips continues to expand,and the size of detector pixel continues to decrease.The precise interconnection between detector chips and readout circuit substrates has becoming increasingly difficult,and the technology had been asked for higher level requirement on the flip chip bonders.To achieve precise interconnection between the detector chips and the readout circuit substrates,the process of flip soldering is analyzed,and it is concluded that the leveling and alignment between the chip and the substrate are key steps.The composition of the optical alignment system for flip chip bonders is introduced,and the collimation optical path system,microscopic imaging system and laser ranging system are also studied.