摘要
阐述了微电子封装气密性要求,提出了绝缘密封技术中胶型的筛选条件。通过制定试验流程,对比样品试验前后剪切力及漏率的变化,验证了不同型号密封胶密封性能及可靠性。通过ANSYS软件建立管壳有限元模型,分析了温度循环过程不同尺寸胶粘封帽管壳应力分布情况。基于管壳应力仿真结果提出结构优化方案,通过对比试验结果与仿真结果验证了结构优化的正确性。
The airtightness requirements of microelectronic package is described,then the screening conditions of the adhesive type in the insulation sealing are put forward.By setting out test procedures,comparing the changes in shear force and leakage rate before and after sample testing,the sealing performance and reliability of different types of sealants are verified.A finite element model of the shell is established by ANSYS software,the stress distribution of the shell with different sizes of adhesive caps during temperature cycle is analyzed.The optimization scheme of shell and tube structure is put forward based on the simulation results.Finally,the correctness of structural optimization is verified by comparing the experimental results with the simulation results.
作者
王淼
柳溪溪
WANG Miao;LIU Xixi(The 13th Institute of CETC,Shijiazhuang 050020,China)
出处
《电子工艺技术》
2024年第2期25-28,共4页
Electronics Process Technology
基金
国家自然科学基金项目(62231014)。
关键词
封帽
胶
有限元
结构优化
package
adhesive
finite element
structure optimization
