浸锡导线电阻焊后锡珠控制研究

Study on solder bead control after resistance welding of dip-tin conductor

为解决小型断路器浸锡导线与线圈电阻焊接产生的锡珠喷溅不良率过高的问题,文中主要从辅助工装、电极材质、以及焊接工艺参数3个方面进行研究。试验研究结果表明,增加吹气工装、电极采用Cu-Al2O3、缓升时间为120 ms、保持时间为200 ms,锡珠喷溅不良率可以从53%降低至1%。

In order to solve the problem of high rate of solder bead spatter caused by resistance welding of dip-tin conductor and coil in miniature circuit breaker,this paper mainly studies from three aspects:auxiliary equipment,electrode material and welding process parameters.The results show that with the addition of air blowing apparatus,adopting Cu-Al 2O 3 electrode,make process parameters of the slow rising time is set at 120 ms,and the holding time is set at 200 ms,the bad spray rate of tin beads decreases from 53%to 1%.