高端印制电路板用硬质合金微型钻头技术发展趋势

Development Trends of Cemented Carbide Micro Drill Bit Technology for High-end Printed Circuit Boards

印制电路板是电子系统中承载电子元器件并连接电路的桥梁,以硬质合金微型钻头为工具的机械钻孔是印制板微孔的主要加工方式。本文对精密微型钻头及其加工技术进行综述,总结出精密微型钻头正朝着新型化、微细化、高精度化和高性能化的发展趋势。同时对高端印制板用极小径微型钻头、大长径比微型钻头和涂层微型钻头的技术发展动态进行综述,指出其超细径、超大长径比和超润滑涂层的发展方向。

Printed circuit board(PCB)is a bridge for carrying electronic components and connecting circuits in electronic system.Mechanical drilling with cemented carbide micro-drill is the main processing method of PCB micropores.In this paper,the precision micro-drill and its processing technology are summarized,and the development trend of precision micro-drill is towards new type,miniaturization,high precision and high performance.At the same time,the technical development trends of ultra-small diameter micro-drill,large aspect ratio micro-drill and coated micro-drill for high-end printed boards are summarized,and the development direction of ultra-small diameter,ultra-large aspect ratio and super-lubricating coating is pointed out.