摘要
在Sn-0.7Cu-0.1Ni焊料中添加不同含量的In,研究了In加入量对焊料合金微观组织、熔化性能、力学性能、润湿性能及界面反应的影响。结果发现,随着In加入量增加,焊料合金的熔点降低,抗拉强度增大,显微硬度变小,润湿性得到优化。同时,焊料合金与Cu基体的界面组织中(Cu,Ni)_(6)Sn_(5)相层有增厚的趋势。
Different contents of In were added to Sn-0.7Cu-0.1Ni solder,and the effects of In content on microstructure,melting behavior,mechanical property,wetting property and interfacial reaction of the solder alloy were investigated.The results indicate that with the increase of In content,the melting point and microhardness of the solder alloy are decreased,meanwhile the tensile strength is increased,so the wettability is optimized.Meanwhile,the(Cu,Ni)_(6)Sn_(5)phase layer tends to be thickened.
作者
王新宝
刘亚
郭志球
陈军修
王建华
苏旭平
Wang Xinbao;Liu Ya;Guo Zhiqiu;Chen Junxiu;Wang Jianhua;Su Xuping(Key Laboratory of Materials Surface Science and Technology of Jiangsu Province,Changzhou University,Changzhou 213164;Zhejiang Jinko Solar Co.,Ltd.,Jiaxing 314416)
出处
《特种铸造及有色合金》
CAS
北大核心
2024年第3期398-403,共6页
Special Casting & Nonferrous Alloys
基金
国家自然科学基金资助项目(52271005)
海宁市协同创新资助项目(20220104)。
