微生物去除加工晶体铜的表面质量实验研究

Experimental Study on Surface Quality of Microbial Removal of Crystalline Copper

通过跟踪微生物去除加工两类不同晶粒尺寸纯铜的表面粗糙度和表面形貌的变化规律,研究了微生物去除加工表面的形成机理。结果表明,纯铜加工表面质量会随着微生物去除加工时间的增加而变差,晶粒粒度会对其微生物加工表面质量产生影响;不同的工件原始表面质量对微生物去除加工初始阶段的表面质量有明显影响;前期机械加工所形成的划痕会随着微生物去除加工而逐渐变小,当机械作用表面被去除后,影响微生物加工表面质量的主要因素是工件的晶界及亚晶界。

The changes of surface roughness and surface morphology of pure copper with different grain sizes are tracked,and the formation mechanism of microbial removal and processing surfaces is studied.The results show that the surface quality of pure copper deteriorates with the increase of microbial removal processing time.Grain size have an impact on changes in the surface quality of microbial processing.Different original surface qualities of workpieces have a significant impact on the surface quality of initial stage of microbial removal processing.The scratches formed by the early mechanical processing will gradually become smaller with the microbial removal processing,and when the mechanical surface is removed,the main factors affecting the surface quality of microbial processing are the grain boundary and subgrain boundary of the workpiece.