具有深腔结构的刚挠结合板制作方法探讨

Production of rigid-flexible PCB with deep cavity structure

印制电路板(PCB)需要在有限的空间内集成更多的功能模块,因此有一种相应的深腔设计。但深腔制作存在深度控制精度差、工艺流程复杂及制作难度高等问题。以一种具有深腔结构的有机发光二极管(OLED)模组刚挠结合板为研究对象,通过解析关键制程工艺、关键控制点,以及对比不同工艺优缺点的方式,对深腔结构的制作难点进行分析,重点介绍了深腔加工的关键制作技术。

Printed circuit boards(PCBs)are required to integrate more functional modules in limited space,hence a deep cavity design is used.However,there are problems such as poor depth control accuracy,complex process flow,and high production difficulty in deep cavity production.This article takes the rigid⁃flexible PCB with deep cavity structure for organic light-emitting diode(OLED)modules as the research object,analyzes and explains the manufacturing difficulties of deep cavity structures through key process analysis,key control point explanation,and comparison of the advantages and disadvantages of different processes,with a focus on the key manufacturing technologies of deep cavity processing.