扇出型封装EMI电磁屏蔽及部分屏蔽处理方案

Fan-Out packaging for EMI electromagnetic shielding and partial shielding solutions

随着科技的进步,电子产品变得不可或缺。扇出型封装技术以其性能和设计灵活性受到关注,提高了芯片整合度和电性能。但高性能电子设备密度和复杂性增加带来电磁干扰(EMI)问题,影响设备运作和信号传输。因此,研发有效的电磁屏蔽技术至关重要。文章探讨了扇出型封装中的EMI问题,提出了电磁屏蔽设计方案,包括Diefirst方案和RDLfirst方案。文章总结了扇出型封装技术发展趋势,探讨了未来挑战并为EMI电磁屏蔽设计提供建议,期望启发未来研究和创新。

With the advancement of technology,electronic products have become indispensable.Fan-out packaging technology has gained attention for its performance and design flexibility,enhancing chip integration and electrical performance.However,the increasing density and complexity of high-performance electronic devices have brought about electromagnetic interference(EMI)issues,affecting device operation and signal transmission.Therefore,the development of effective electromagnetic shielding technology is crucial.This article explores EMI issues in fan-out packaging and proposes electromagnetic shielding design solutions,including the Die first approach and RDL first approach.This article summarizes the development trends in fan-out packaging technology,discuss future challenges,and provides recommendations for EMI electromagnetic shielding design,hoping to inspire future research and innovation.