一种基于热阻矩阵的2.5D封装芯片结温预测模型

A Junction Temperature Prediction Model for 2.5D Packaging Chip Based on Thermal Resistance Matrix

随着2.5D封装芯片的封装尺寸不断减小和功率密度持续增加,芯片内部温度急剧上升。为了满足芯片散热和可靠性需求,准确预测服役过程中芯片的结温具有重要的意义。在充分考虑热耦合效应后,从2.5D封装芯片的热阻网络拓扑结构出发,提出了一种基于热阻矩阵的2.5D封装芯片结温预测模型。同时,采用FloTHERM热仿真软件对该预测模型进行了验证。结果表明,在对2.5D封装芯片施加不同功率后,该模型的计算结果和FloTHERM仿真结果相对误差小于5%。由此说明,该模型能够高效准确地预测2.5D封装芯片的结温。

As the package size of 2.5D packaging chip continues to decrease and the power density continues to increase,the internal temperature of the chip rises sharply.In order to meet the heat dissipation and reliability requirements of the chip,it is of great significance to accurately predict the junction temperature of the chip.After fully considering the thermal coupling effect,a junction temperature prediction model of 2.5D packaging chip based on thermal resistance matrix is proposed.Meanwhile,the FloTHERM thermal simulation software is used to verify the prediction model.The results show that when different power is applied to 2.5D package chip,the relative error between the calculation results of the model and the simulation results of FloTHERM software is less than 5%,which indicates that the model can predict the junction temperature of 2.5D packaging chip efficiently and accurately.