金属顶盖封装芯片的翻新识别方法及应用

The Identification Methods and Application of the Refurbished Chips Packaged with Metal Lid

随着对电子产品的可靠性的要求越来越高,对芯片假冒翻新更是零容忍。传统的假冒翻新判断方法和判据更多的是针对塑封器件,带金属顶盖封装芯片的翻新识别方法和依据尚属于行业空白。基于带金属顶盖芯片封装结构、破坏性物理分析和相关行业标准,制定了一套针对带金属顶盖封装芯片的翻新识别方法。同时,根据以往翻新识别工作中的案例,发现90%以上带金属顶盖封装芯片可以通过热界面材料的轮廓、类型和颜色进行翻新识别。这些成果为翻新芯片的识别提供了十分重要的工程手段,且为电子产品制造可靠性提升奠定了坚实的技术基础。

With the increasing demand for the reliability of electronic products,there is no tolerance for counterfeited and refurbished chip.The traditional counterfeit refurbishment judgment methods and criteria are mainly for plastic sealed devices,and the refurbishment identification methods and basis of metal capped chip are still blank in the industry.The identification methods for the refurbished chip with metal lid are developed based on the packaging structure,destructive physical analysis and relevant industry standards.According to the the cases in the previous refurbishment identification work,it is found that more than 90%of the refurbished chips with metal lid can be identified by the outline,types and colors of thermal interface materials.These results provide a very effective method for identification of refurbished chip,and lay a solid technical fundation for improving the reliability of electronic products manufacturing.