集成式陶瓷压力传感器结构设计与测试分析

Structural design and test analysis of integrated ceramic pressure sensor

本文设计并制备了一种集成式陶瓷压力传感器。首先基于电容式压力传感器工作原理和薄板变形理论,对传感器敏感结构进行建模和仿真分析。将设计的信号调理电路集成在印刷电路板(PCB)上,PCB通过导电结构PIN针与敏感结构紧贴在一起,采用压缩弹簧实现针脚连接。同时设计了传感器敏感结构工艺制备流程,并对封装后的传感器进行研究分析。测试结果表明:传感器在0~1.4 MPa量程内,常温下其灵敏度达到0.571 V/V/MPa,非线性度小于0.325%FS,在-40~150℃温度范围内,整体测量误差精度为±0.245%RH,传感器在振动和冲击的环境中工作稳定。

An integrated ceramic pressure sensor is designed and prepared.Firstly,the sensitive structure of the sensor is modelled and simulated based on the working principle of capacitive pressure sensors and the theory of thin plate deformation.The designed signal conditioning circuit is integrated on a printed circuit board(PCB),which is tightly attached to the sensitive structure by conductive structure PIN pins,compression springs are used for pin connection.A process preparation flow for sensitive structure of sensor is also designed and the encapsulated sensor is studied and analyzed.The test results show that the sensitivity reaches 0.571 V/V/MPa at room temperature within the range of 0~1.4 MPa,non-linearity is less than 0.325%FS,the overall measurement error precision is±0.245%RH in the temperature range of-40~150℃,the sensor works stably in an environment of vibration and shock.