导热胶导热性能的研究进展与探讨

Research progress and discussion on the thermal conductivity of thermal conductive adhesive

随着消费电子产品的迅速普及和技术的不断进步,导热胶市场需求不断增加,发展潜力巨大。但在小型化、集成化和便携性电子产品快速发展的同时,也对导热胶的导热性能提出了更高的要求。为此,本文介绍了填充型导热胶的导热机理,论述了传统导热模型的应用范围及有限元模拟预测导热系数的方法。综述了近年来导热胶胶体的研究成果,并着重论述了导热胶填料的种类、形状、粒径、改性及导热填料的混合使用对导热胶导热系数的影响规律,总结了提升导热胶导热系数的方法。

With the rapid popularization of consumer electronic products and the continuous progress of technology,the thermal conductive adhesive market demand continues to increase,and the development potential is huge.However,while miniaturization,integration,and portability of electronic products are rapidly developing,higher requirements are also put forward for the thermal conductivity of thermal conductive adhesive.Therefore,in this article,the thermal conductivity mechanism of filled thermal conductive adhesive was introduced,the application scope of traditional thermal conductivity models,and the method of finite element simulation to predict the thermal conductivity coefficient were discussed.The research achievements of thermal conductive adhesive colloids in recent years were reviewed,and the type,shape,particle size,modification of thermal conductive adhesive fillers,as well as the influence of the mixed use of thermal conductive fillers on the thermal conductivity coefficient of thermal conductive adhesive were described emphatically,and the methods for improving the thermal conductivity coefficient of thermal conductive adhesive were summarized.