半挠性高精密互联印制板加工技术研究

Research on the processing technology of semi-flexible and high-precision interconnected printing board

文章主要介绍了一款2阶叠孔高密度互连(HDI)半挠性印制板,此款产品集不对称压合、电镀填孔、揭盖等特点,且各层次芯板底铜厚度不同,需经多次减铜流程,严格控制面铜厚度,以保证最小线宽精度,产品集HDI和半挠性印制板特性于一身,有一定的制作难度。通过制作前识别产品制作过程中重点和难点,对关键技术进行优化,有效保证了产品的质量。

This paper mainly introduces a second-order high-density interconnection(HDI)semi-flexible printed circuit board.This product has the characteristics of asymmetric pressing,hole filling by electroplating,cover uncovering,etc.,and the copper thickness at the bottom of each layer of the core board is different.It is necessary to go through several copper reduction processes,strictly control the surface copper thickness,and ensure the minimum line width accuracy.The secondary product combines the characteristics of HDI and semi-flexible printed circuit board,so it is difficult to manufacture.By identifying the key points and difficulties in the production process before production,and optimizing the key technologies,the product quality is effectively guaranteed.