摘要
阐述低电压供电、PCB设计的高密度与高速化、去耦电容优化和电热协同分析的问题、原因及挑战。以FPGA技术为重点,探讨其原理、特征以及在高频高速集成电路设计中的关键作用。
This paper describes the problems,causes,and challenges of low voltage power supply,high-density and high-speed PCB design,optimization of decoupling capacitors,and analysis of thermoelectric synergy.Focusing on FPGA technology,it explores its principles,characteristics,and key roles in high-frequency and high-speed integrated circuit design.
作者
简震谦
JIAN Zhenqian(Suzhou Yige Technology Co.,Ltd.Shanghai Branch,Shanghai 201210,China.)
出处
《集成电路应用》
2024年第2期320-321,共2页
Application of IC