金刚石微粉粒度、形貌及杂质含量对划片刀电镀上砂的影响

The Effect of Particle Size, Morphology, and Impurity Content of DiamondMicropowder on the electro-embedding abrasive of Dicing Blade

晶圆片的划切是半导体行业内使用最广泛的工艺,通过该工艺实现晶片的单体化。电镀划片刀是晶圆划片常用的工具之一,划片刀刀刃部分一般由金属镍和金刚石磨料组成。划片刀电镀过程中沉积磨料的多少直接影响刀片的性能和使用寿命,因此电镀上砂量在刀片的制程中须严格控制。随着划片刀磨料粒度的减小,电镀上砂的难度加大。文章讨论了金刚石微粉的粒度、形貌及杂质含量对电镀上砂量和分散程度的影响。试验证明微粉粒度对上砂量影响较大,微粉内外部杂质含量对电镀上砂也有影响,但对镀层磨料的分散性没有明显影响。微粉形貌对电镀上砂的浓度和分散性影响不大。

Wafer dicing is the most widely used process in the semiconductor industry,which achieves the monomer formation of chips.Electroplating dicing blade is one of the commonly used tools for wafer scoring,which is generally composed of metallic nickel and diamond abrasives.The amount of abrasive deposited during the electroplating process directly affects the performance and service life of the blade,so the amount of diamond abrasives embedded during electroplating must be strictly controlled during the blade manufacturing process.As the abrasive particle size decreases,the difficulty of electro-embedding of abrasives increases.This article discusses the effects of particle size,morphology,and impurity content of diamond abrasives on the amount and dispersion of electro-embedding abrasives.The experiment has shown that the particle size of abrasives has a significant impact on the amount of abrasives embedded,the content of internal and external impurities in abrasives also has an impact on electro-embedding abrasives,but it has no significant effect on the dispersibility of the coating abrasives.The morphology of abrasives has little effect on the concentration and dispersion of electro-embedding abrasives.