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Recrystallization effect on surface passivation of Hastelloy X alloy fabricated by laser powder bed fusion

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摘要 Post-heat treatment is generally adopted in the additive manufacturing field due to its alleviation of high residual stress and modification of rapid-solidified multilevel heterogeneous microstructure,and the related performance of the heat-treated counterparts calls for a systemic investigation to build a criterion of the heat treatment procedure.In this work,we focus on the heat treatment effects on the recrystallization of the Hastelloy X alloy produced by the laser powder bed fusion(LPBF)method,and the related surface passivation of the heat-treated counterparts is meticulously assessed as well.Results show that the multilevel heterostructure for LPBF Hastelloy X alloy consists of sub-micro dislocation cell substructures with Cr/Mo elemental segregation,fine columnar grains,and periodically-distributed molten pools.After heat treatment,partially and fully recrystallized structures for LPBF Hastelloy X alloys were achieved at 1100 and 1200℃for 1 h,respectively.Furthermore,the as-built LPBF Hastelloy X alloy shows superior corrosion resistance while the heat-treated one(1100℃)exhibits the worst in the borate buffer solution.The growth of passive film exhibited a highly linear correlation with the nucleation process controlled by diffusion,and high dislocation density and low angle grain boundary decreased the diffusion coefficient of cation vacancies,augmenting the nucleation sites of the passive film and enhancing its growth rate.Moreover,the micro-galvanic effect resulting from the partially recrystallized microstructure actively facilitated the formation of inhomogeneous porous passive films,leading to the worst corrosion resistance.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2023年第32期245-258,共14页 材料科学技术(英文版)
基金 the National Science Fund for Distinguished Young Scholars(No.52125102) the China Postdoctoral Science Foundation(Nos.2022TQ0203 and 2022M722047) Fundamental Research Funds for the Central Universities(No.FRF-TP-2021-02C2) Shanghai Technical Barriers to Trade(No.2021TBT004).
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