新型电缆外半导电层切割倒角器的研制

Development of a New Type of Cable Outer Semiconductive Layer Chamfering Device

配网电缆附件制作施工中剥离外半导电屏蔽层、外半导电屏蔽层断口和绝缘层断口倒角时,施工人员一般依靠感觉和经验,难以控制切割的深浅度和平稳度,无法保证电缆的断口和倒角光滑平整,不能与冷缩主体(应力锥)紧密搭接,易造成尖端放电效应,留下严重安全隐患。文章旨在开发一种用于配网电缆切割外半导电屏蔽层环切和纵切、外半导电屏蔽层断口和绝缘层断口倒角的三合一专用刀具。该研究能够显著提高电缆的断口和倒角的光滑度和平整度,提升工作效率,降低电缆头绝缘损坏的隐患风险。

When peeling off the outer semi-conductive shielding layer,the fracture of the outer semi-conductive shielding layer and the chamfer of the insulation layer in the production and construction of distribution cable accessories,the constructors generally rely on their feelings and experiences,and it is difficult to control the depth and stability of cutting,which can not guarantee the smoothness and smoothness of the cable fracture and chamfer,and can't closely overlap with the cold shrinkage main body(stress cone),which is easy to cause tip discharge effect and leave serious potential safety hazards.The purpose of this study is to develop a three-in-one special cutter for cutting the outer semi-conductive shield,cutting the outer semi-conductive shield and chamfering the outer semi-conductive shield and insulating layer.This study can significantly improve the smoothness and flatness of the cable fracture and chamfer,improve the work efficiency and reduce the hidden danger of cable head insulation damage.