摘要
采用CFD流固耦合数值模拟,以TPMS(三重周期性最小表面)结构为核心构建直流空间内芯片散热热沉。对比了同种条件下的Diamond,Gyroid,I-WP,Fischer-Koch和F-RD五种TPMS结构和同等孔隙率的传统翅片结构的温度场和流体的速度和压力场。构建无量纲局部性能评价指标对六种结构的冷却效果进行综合比较后表明,TPMS结构比常规翅片结构有16.6%~50.6%的性能提升,其中Fischer-Koch的散热能力最为突出,其在受限空间下有更大的散热潜力,内部流动换热比翅片结构的优势最高可达12倍。
A direct current chip heat sink with a Triply Periodic Minimal Surface(TPMS)structure as the core was constructed using Computational Fluid Dynamics(CFD)fluid-solid coupling numerical simulation.The temperature field,fluid velocity,and pressure field of five TPMS structures(Diamond,Gyroid,I-WP,Fischer-Koch,and F-RD)with the same conditions and a traditional fin structure with equivalent porosity were compared.A dimensionless local performance evaluation index was established to comprehensively compare the cooling effects of the six structures.The results indicated that TPMS structures exhibited a performance improvement of 16.6%to 50.6%compared to conventional fin structures.Among them,the Fischer-Koch structure demonstrated the most prominent heat dissipation capability,with greater cooling potential in constrained spaces.The internal flow heat transfer advantage of the Fischer-Koch structure was up to 12 times higher than that of the fin structure.
作者
王佳选
钱琛怿
俞彬彬
钟豪章
施骏业
陈江平
WANG Jiaxuan;QIAN Chenyi;YU Binbin;ZHONG Haozhang;SHI Junye;CHEN Jiangping(Institute of Refrigeration and Cryogenics,Shanghai 200240,China;Institute of Materials Modification and Modelling Shanghai 200240,China)
出处
《工程热物理学报》
EI
CAS
CSCD
北大核心
2024年第4期1076-1082,共7页
Journal of Engineering Thermophysics
基金
国家重点研发计划(No.2020YFA0711500)。