烧结温度对W-Cu合金微观组织及性能的影响

Effect of Sintering Temperature on Microstructure and Properties of W-Cu Alloys

以W粉和Cu粉为原料,采用粉末冶金和无压烧结的方式,分别在900,1000,1100和1200℃下制备了W-Cu合金。通过对样品的微观组织分析、密度和冲击强度的测试,探讨了不同烧结温度下W-Cu合金的组织及其性能变化。结果表明,随着烧结温度的升高,合金微观组织中的孔隙先减少后增加。在1100℃时,可以得到综合性能最佳的W-Cu合金,其密度和冲击强度分别达到11.51 g/cm^(3)和18.78 kJ/m^(2)。

Using W and Cu powders as raw materials,W-Cu alloys were prepared via powder metallurgy and pres-sure-less sintering at 900,1000,1100 and 1200℃,respectively.Through the microstructure analysis of the samples,as well as density and impact strength tests,effect of sintering temperature on microstructure and properties of W-Cu alloys were investigated.The results indicated that the porosity in the microstructure first decreased and then increased with the rise of the sintering temperature.W-Cu alloys with the best comprehensive performance could be obtained at a sintering temperature of 1100℃,and its density and impact strength reaching 81.9%and 18.78 kJ/m^(2),respectively.