摘要
以端乙烯基硅油(1000 mPa·s)和侧乙烯基硅油(500 mPa·s)复配为基体树脂,含氢硅油为固化剂,乙烯基硅烷偶联剂为增黏剂,乙烯基MQ树脂和气相白炭黑为补强材料,氢氧化镁和硅系阻燃剂(FCA-107)为阻燃填料,成功制备了一款具有无卤阻燃特性及优异力学性能和电气绝缘性能的有机硅灌封胶,并研究了硅油复配比例、各填料添加量对有机硅灌封胶性能的影响。结果表明:当端乙烯基硅油与侧乙烯基硅油的复配比例为5∶5,乙烯基硅烷偶联剂质量分数为3%,气相白炭黑质量分数为4%,乙烯基MQ树脂质量分数为30%,复配阻燃剂质量分数为20%时,有机硅灌封胶的综合性能达到最佳,其混合黏度为1842 mPa·s,拉伸强度为2.83 MPa,断裂伸长率为51.3%,拉伸剪切强度为2.12MPa,阻燃性能(UL 94)达到V-0级,电气强度达到24.3 kV/mm,体积电阻率为3.8×10^(15)Ω·cm,制备的有机硅灌封胶可以满足电子元器件的发展要求。
A high-performance organsilicone encapsulant was prepared with vinyl silicone oil interchange as base polymer,hydrogen-containing silicone oil as crosslinker agent,fumed silica and MQ silicone resin as reinfocing materials,magnesium hydroxide and FCA107 as flame-retardant filler.The effects of the ratio of between Vi-PDMS and Vi-PMVS and filler content on the properties of organsilicone encapsulant were discussed.The results show that when the ratio of between Vi-PDMS and Vi-PMVS is 5:5,the mass fraction of vinyl silane coupling agent is 4%,the mass fraction of MQ silicone resin is 30%,the mass fraction of compound flame retardant is 20%,the organsilicone encapsulant has optimum comprehensive performance.The mixed viscosity is 1842 mPa·s,the tensile strength is 2.83 MPa,the elongation at break is 51.3%,the shear strength is 2.12 MPa,the flammability rating is UL 94 V-0,the dielectric strength is 24.3 kV/mm,and the volume resistivity is 3.8×10^(15)Ω·cm.The prepared organsilicone encapsulant could satisfy the development demands of electronic components.
作者
黄安民
朱伟
符玄
颜渊巍
娄建坤
HUANG Anming;ZHU Wei;FU Xuan;YAN Yuanwei;LOU Jiankun(Zhuzhou Times New Material Technology Co.,Ltd.,Zhuzhou 412007,China)
出处
《绝缘材料》
CAS
北大核心
2024年第4期56-59,共4页
Insulating Materials
基金
国家重点研发计划项目(2022YFB2502801)。
关键词
有机硅灌封胶
低黏度
阻燃
力学性能
电气绝缘性能
organsilicone encapsulant
low viscosity
flame retardant
mechanical properties
electrical insulation performance