基于Micro CT的铜导线短路熔痕孔洞特征分析

Analysis of the characteristics of short circuit melt marks and holes in copper conductors based on Micro CT

导线短路是造成电气火灾的重要原因之一。现行国家标准中将导线短路熔痕分为起火前发生的一次短路熔痕和起火后造成的二次短路熔痕,然而现行国家标准中的鉴定仅停留在定性判断的阶段。火灾现场铜导线短路熔痕特征的量化分析研究是国内外研究人员主要关注的重点。本文应用Micro CT技术对铜导线短路熔痕进行断层扫描检测并重构铜导线短路熔痕的3D图像数据,在此基础上统计、归纳、总结铜导线短路熔痕内部孔洞形态及分布等孔洞特征。研究表明,Micro CT能够全面采集铜导线短路熔痕的整体形态和内部孔洞特征,一次短路熔痕与二次短路熔痕内部孔洞半径、表面积、紧密度的特征数据存在差别,可为短路熔痕定性和定量分析判据研究提供新的理论依据。

Short circuit of wires is one of the important causes of electrical fires.The current national standard divides wire short circuit marks into primary short circuit marks before ignition and secondary short circuit marks caused after ignition.However,the identification in the current national standard only stays at the stage of qualitative judgment.The quantitative analysis of the characteristics of short circuit marks on copper wires at fire sites has become the main focus of attention for China and other coun⁃tries researchers.This paper applies Micro CT technology to per⁃form fault scanning detection on copper wire short circuit melt marks and reconstruct 3D image data of copper wire short circuit melt marks.Based on this,the internal pore morphology and dis⁃tribution of copper wire short circuit melt marks are statistically analyzed,summarized,and summarized.Research has shown that Micro CT can comprehensively collect the overall morphol⁃ogy and internal pore characteristics of copper wire short-circuit melt marks.There are differences in the characteristic data of pore radius,surface area,and tightness between primary and second⁃ary short-circuit melt marks,which can provide new theoretical basis for qualitative analysis methods and quantitative analysis cri⁃teria of short-circuit melt marks.