导电(Cu,Mn)_(3)O_(4)接触层在SOEC阳极侧的应用

Application of Electrically-conductive(Cu,Mn)_(3)O_(4)Contact Layer on Anode-Side of SOEC

固体氧化物电解池(SOEC)中铁素体不锈钢合金连接体和电解池阳极之间存在界面接触、连接体表面氧化以及氧电极“铬毒化”等问题,是导致电解堆性能衰减的重要影响因素之一。本工作利用反应烧结工艺在连接体与阳极之间制备了多孔的(Cu,Mn)_(3)O_(4)导电接触层,形成了粘结强度高的连接体/接触层/电解池界面结构。所得试样在750℃下表现出优异的电性能,整个500 h测试过程半电池的面比电阻(ASR)值稳定保持在20.13~20.32 mΩ·cm^(2)。通过微观结构表征技术证实,多孔(Cu,Mn)_(3)O_(4)接触层与相邻的电解堆部件具有良好的兼容性,并可以抑制连接体表面的氧化薄膜增长,同时阻止铬元素的迁移。(Cu,Mn)_(3)O_(4)接触层也降低了电解池与集流体之间的接触电阻,提高了电池电化学输出性能。

In SOEC stack,several issues including high contact resistance,oxidation of interconnect surface as well as anode‘Cr poisoning’exist between the interconnect and anode,which can significantly result in performance degradation for the stack.In this study,the(Cu,Mn)_(3)O_(4)-based spinel was evaluated as the SOEC anode-side contact material.A mixture of Mn and CuO was thermally converted into the spinel layer to lower the sintering temperature and enhance the performance.A simulated interconnect/contact/anode cell was fabricated to investigate the effectiveness of the reactively-sintered contact layer on the electrical performance and chemical compatibility.The tested cell exhibited extremely stable behavior with an ASR of only 20.13—20.32 mΩ·cm^(2).While the Cr-rich oxide scale was effectively reduced,no obvious interdiffusion was observed between the contact layer and adjacent cell component at each interface.The(Cu,Mn)_(3)O_(4)contact layer improved the electrochemical performance of the test cell,significantly reduced the contact resistance.