摘要
气密性封装是高可靠集成电路制造的关键技术。探讨了金属盖板表面镀层形貌对平行缝焊器件耐盐雾性能的影响。研究发现,平行缝焊后金属盖板表面出现的贯穿性裂纹是降低平行缝焊器件耐盐雾性能的关键因素。在相同封帽参数下,表面镀层为长条形晶胞的盖板封帽后出现多条贯穿性裂纹,无法通过24 h盐雾试验后气密性检测。而表面镀层为均匀大小的圆形晶胞的盖板具备更高的抗封帽裂纹能力,封帽后无贯穿性裂纹出现,且可通过48 h盐雾试验后气密性检测。
Hermetic sealing is one of the key technologies in the manufacturing of high reliability integrated circuits.The effects of the surface coating morphology of the metal cover plate on the salt atmosphere resistance of parallel seam welding devices are investigated.The result reveals that the occurrence of penetrating cracks on the surface of the metal cover plate after parallel seam welding is a pivotal factor in diminishing the salt atmosphere resistance of parallel seam welding devices.Under equivalent sealing parameters,metal cover plate with elongated crystal cells on the surface coating exhibits multiple penetrating cracks,which cannot pass the seal test after 24 h salt atmosphere exposure.And the metal cover plate with uniformly sized circular crystal cells on the surface coating demonstrates a higher resistance to sealing-induced cracks,showing no crack after sealing and passing the seal test after 48 h salt atmosphere exposure.
作者
马明阳
曹森
杨振涛
张世平
欧彪
MA Mingyang;CAO Sen;YANG Zhentao;ZHANG Shiping;OU Biao(Shenzhen State Microelectronics Co.,Ltd.,Shenzhen 518057,China;China Electronics Technology Group Corporation No.13 Research Institute,Shijiazhuang 050057,China)
出处
《电子与封装》
2024年第4期30-35,共6页
Electronics & Packaging
关键词
封装
平行缝焊
金属盖板
镀层形貌
盐雾试验
气密性检测
package
parallel seam welding
metal cover plate
coating morphology
salt atmosphere exposure
seal test