摘要
刚性印制板(RPCB)经过局部铣切加工成为可折弯板,其生产过程中需要重点管控折弯区域材料的选用及厚度(控深铣管控)。通过对折弯区域控深铣的生产及管控流程进行研究,总结出一种适合该类型折弯板控深铣的生产及管控制作流程,能满足弯曲180°(10次)的要求。热应力、回流焊后均无爆板、分层、绿油起泡等可靠性异常,满足品质需求。
The production process of the bendable printed circuit board(PCB)plate needs to focus on the selection and thickness of the materials in the bending area(the control of the depth control routing).This paper mainly studies the production and control process of bending zone depth control routing,and summarizes a production and control process suitable for this type of bendable PCB depth control routing which can meet the requirement of bending 180°(10 times).After thermal shock and reflow soldering testing,there are no reliability abnormalities such as bursting,delamination,and solder mask foaming,which means that the bendable PCB can meet the quality requirements.
作者
王伟业
文跃
瞿云锋
郑绪华
WANG Weiye;WEN Yue;QU Yunfeng;ZHENG Xuhua(Guangdong Ellington Electronics Technology Co.,Ltd.,Zhongshan 528445,Guangdong,China)
出处
《印制电路信息》
2024年第4期16-19,共4页
Printed Circuit Information
关键词
可折弯印制板
控深铣
工艺路线
bendable printed circuit board(PCB)
depth control routing
process route