PCB电镀铜后热处理对制程及性能的影响分析

Effect of heat treatment after Cu plating on PCB process and performance

随着手机通信及消费类产品不断向轻、薄、小、精、密等设计特征方向发展,对配套使用的高密度互连(HDI)板的设计要求越来越高,制作过程中的流程设计与参数规格管控也越来越严格。通过对印制电路板(PCB)制造过程中,电镀铜后有无热处理流程对镀铜层微观晶体结构的变化影响、镀铜的物理特性,以及对后工序的产品品质综合特性进行研究,探讨了充分识别产品微观变化类型及潜在作业品质影响的价值,阐述了制作流程设计优化对高端精细PCB产品的重要性。

With the continuous development of mobile phone communication and consumer products in the direction of light,thin,small,fine,dense and other design features,the design requirements of high density interconnector(HDI)printed circuit board(PCB)products used in supporting products are getting higher and higher,and the process design and specification control in the production process are becoming more and more stringent.In this paper,through the study of the influence of heat treatment process on the crystal microstructure and the physical properties of plating copper in the PCB manufacturing process,and the comprehensive characteristics of product quality in the copper plating post-process,the importance of fully identifying microstructure changes of products and the potential impact on product quality,and the signficance of optimizing the design of the production process for the successful production and application reliability of high-end fine PCB products are discussed.