LGA焊接工艺研究

Research on the LGA Welding Process

随着电子制造业的发展,栅格阵列封装(LGA)封装越来越多地应用在各种电子产品上。由于其扁平式、无预上焊料的结构,非常容易造成焊接后焊点空洞过大,进而影响其焊接的可靠性。LGA焊点空洞在所有贴装类型元件中相对较难控制,如何减少LGA焊接空洞成为当前表面贴装(SMT)行业的难题之一。主要从采用不同锡膏、不同钢网开孔和不同回流焊接曲线等3个方面,探讨了不同的工艺手段对焊接空洞的影响,以及如何优化焊接工艺以减少LGA元件的空洞。

With the development of electronic manufacturing industry,LGA package is increasingly used in various electronic products more.Because of its flat structure and no pre-solder perform,it is very easy to cause the solder joint voids to be very large after reflow soldering,which affects the reliability of soldering.LGA solder void hollow in all mounting components is relatively difficult to control,how to reduce the LGA soldering voids has become one of the current problems in the SMT industry.The influence of different process methods on voids and how to optimize the welding process to reduce voids in LGA components are mainly discussed from the three aspects of the use of different solder paste,different steel mesh holes and different reflow welding curve.