现代电子装联工艺技术的展望

Outlook on Modern Electronic Assembly Technology

阐述电子装联工艺技术的特点,针对电子装联工艺技术现状,探讨现代电子装联工艺技术,以及系统的设计与实现,包括装联材料和工艺的选用。展望现代电子装联工艺技术的发展趋势。

This paper expounds the characteristics of electronic assembly process technology,explores modern electronic assembly process technology,as well as the design and implementation of the system,including the selection of assembly materials and processes,in response to the current situation of electronic assembly process technology.It looks forward to the development trend of modern electronic assembly technology.