电气产品通孔回流焊工艺研究

Research on through-hole reflow soldering process for electrical products

随着电气产品向密集化、小型化方向快速发展,表面贴装技术已成为印制电路板(PCB)组装的主流技术,因此通孔回流焊工艺的应用越来越广泛。本文重点从锡膏选型、钢网开孔工艺优化、元器件性能、PCB焊盘设计优化等角度展开研究,并通过实际生产验证了通孔回流焊工艺能够拓展高密度、细间距产品的生产窗口,并解决了锡珠、空洞等焊接问题。该工艺能从多方面替代传统波峰焊工艺,可提升元器件的焊接质量,使焊接可靠性大大提高,为有效推进表贴化工艺、降低生产成本、提高生产效率提供支撑。

With the rapid development of electrical products towards density and miniaturization,surface mount technology has become the mainstream of printed circuit board(PCB)assembly,so the application of through-hole reflow soldering technology is becoming increasingly widespread.This paper focuses on the selection of solder paste,optimization of steel mesh opening process,component performance,and optimization of PCB pad design.Through actual production verification,the through-hole reflow soldering process can expand the production window of high-density and fine pitch products,and solve soldering problems such as tin beads and voids.This process can replace traditional wave soldering in many aspects,effectively improving the soldering quality of components in through-hole reflow soldering,improving soldering reliability,and providing support for effectively promoting surface mount technology,reducing production costs and improving production efficiency.