丙烯酸酯基导电压敏胶研究进展

Research progress in acrylate-based conductive pressure sensitive adhesive

综述了丙烯酸酯基导电压敏胶的三类填料的研究进展,包括金属填料、无机非金属填料以及杂化填料。对丙烯酸酯基导电压敏胶的结构设计进行了汇总,包括在丙烯酸酯基础上接入氨基甲酸酯键、环氧基团的导电压敏胶。最后对丙烯酸酯基导电压敏胶未来发展进行了展望。

The research progress of three types of fillers for acrylate-based conductive pressure sensitive adhesive,including metal fillers,inorganic non-metallic fillers,and hybrid fillers were reviewed.The structural design of acrylate-based conductive pressure sensitive adhesive,which includes accessing to urethane bond and epoxy group on the basis of acrylate-based conductive pressure sensitive adhesive was summarized.Finally,the future development of acrylate-based conductive pressure sensitive adhesive was prospected.