集成电路用超高纯铝铸造生产实践研究

Research on Production Practice of Ultra-high Purity Aluminum Casting for Integrated Circuits

超高纯铝铸锭是溅射靶材的上游关键材料,本课题根据生产实践中的对比试验,探究不同原料配比对超高纯铝铸锭的不纯物、颗粒物、内部质量的影响,旨在为生产高品质集成电路用超高纯铝铸锭提供参考。生产实践结果表明,重熔料表面进行清理是必要步骤,随着重熔料在原料中占比升高,铝中颗粒物夹杂数量和尺寸有升高和长大的趋势,在生产实践中重熔料在原料中的占比应该控制在30%以下。

Ultra-high purity aluminum ingot is the key material upstream of sputtering target.Based on the comparative test in production practice,this topic explores the influence of different raw material ratio on the impurity,particulate matter and internal quality of ultra-high purity aluminum ingot,aiming to provide reference for the production of high-quality integrated circuit ultra-high purity aluminum ingot.The production practice results show that cleaning the surface of the remelt is a necessary step.With the increase of the proportion of remelt in the raw material,the number and size of particulate inclusions in aluminum have a trend of increasing and growing,and the proportion of remelt in the raw material should be controlled below 30%in the production practice.