基于插片散热器的某功放单元设计

Design of power amplifier using fin heat sinks

设计一款可在室内机房环境条件下工作,总热耗约为2700 W,结构紧凑、散热方式简单、散热效果良好,可安装在19寸机柜内的功放单元。依据该功放单元工作原理、内部器件布局、热耗,综合考虑散热与结构要求,设计一种采用组合插片散热器强迫风冷的方案。通过功放模块和电源分组固定安装在分层的3个插片散热器上,同时与设备侧壁形成完整的风道的方式,实现了功放单元的强迫风冷散热;并对该设备进行了热传导与散热理论计算,同时运用仿真软件建立模型,进行数值分析。数值仿真结果显示,该功放单元正常工作热交换达到平衡状态时,功放模块外壳最高温度为64.2℃,满足设计要求。通过实物样机验证了该功放单元基于组合插片散热器结构设计方案的可行性,以及计算、仿真方法的合理性、正确性。

In order to design a power amplifier that can work under indoor computer room environmental conditions,with a total heat consumption of about 2700 W,a compact structure,simple heat dissipation method,good heat dissipation effect,and can be installed in a 19 inch cabinet.Based on the working principle of the power amplifier unit,internal device layout,heat consumption,and comprehensive consideration of heat dissipation and structural requirements,a scheme using a combined plug-in heat sink for forced air cooling is designed.By fixing the amplifier module and power supply group on three layered plug-in heat sinks,and forming a complete air duct with the equipment sidewall,the forced air cooling heat dissipation of the amplifier unit is realized.Based on the working principle of the power amplifier unit,internal device layout,heat consumption,and comprehensive consideration of heat dissipation and structural requirements,a design scheme using a combined plug-in heat sink for forced air cooling is designed.The power amplifier module and power supply are installed in groups on three layered heat sinks,and a complete air duct is formed with the equipment sidewall to achieve forced air cooling and heat dissipation of the power amplifier unit.Theoretical calculations of heat conduction and heat dissipation were conducted on the device,and a model was established by the simulation software for numerical analysis.The numerical simulation results show that when the heat exchange of the amplifier unit reaches equilibrium during normal operation,the maximum temperature of the amplifier module casing is 64.2℃,which meets the design requirements.The feasibility of the design scheme of the power amplifier unit based on the combination insert heat sink structure and the rationality and correctness of the calculation and simulation methods are verified by means of the physical prototypes.