摘要
基于飞行时间(Time of Flight,ToF)的三维(three dimensional,3D)成像技术属于主动式三维成像技术,其通过测量调制光“飞行”往返于目标物体与传感器之间所需要的时间,进而计算出目标物体的距离信息。相较于其他3D成像方式,基于ToF的3D成像方法具有微型化、结构简单、功耗低等优势。随着技术的发展,间接ToF(Indirect ToF,IToF)图像传感器像素尺寸逐渐缩小、分辨率逐渐增大、精度逐渐提高,应用于多种场景,但是其仍然存在背景光干扰、多径干扰、运动伪影等问题。本文第一节介绍ToF图像传感器的工作原理;第二节总结分析ToF图像传感器的参数指标及其发展趋势;第三节分析ToF图像传感器面临的挑战并提供解决方案;第四节分析应用于ToF技术的图像校正及还原算法。
Three-dimensional(3D)imaging technology based on Time-of-Flight(ToF)belongs to active 3D imaging technology.It calculates the distance information of the target object by measuring the time needed for modulated light to"fly"back and forth between the target object and the sensor.Compared to other 3D imaging methods,ToF-based 3D imaging methods have significant advantages such as miniaturization,simple structure,and low power consumption.With the development of technology,Indirect Time-of-Flight(IToF)image sensor pixel size gradually decreases,resolution increases,and accuracy improves,making it applicable in various scenarios.However,it still faces challenges such as background light interference,multipath interference,and motion artifacts.The working principle of ToF image sensors is introduced in section 1.The parameter indicators of ToF image sensors and their development trends are analyzed in section 2.The challenges faced by ToF image sensors are analyzed and the solutions are proposed in section 3.The image correction and restoration algorithms applied to ToF technology are introduced in section 4.
作者
徐江涛
陈全民
王欢欢
聂凯明
高静
XU Jiangtao;CHEN Quanmin;WANG Huanhuan;NIE Kaiming;GAO Jing(School of Microelectronics,Tianjin University,Tianjin 300072,China)
出处
《集成电路与嵌入式系统》
2024年第5期1-9,共9页
INTEGRATED CIRCUITS AND EMBEDDED SYSTEMS
基金
国家重点研发计划资助(2022YFB2804401)