摘要
阐述一种芯片的参数温度变化率批量自动化测试方法,解决芯片ATE测试中对超低温度变化率(5ppm/℃以下)的芯片参数进行批量化、自动化测试的问题,测试完成后提供与芯片同步测试数据。
This paper describes a batch automated testing method for the temperature change rate of chip parameters,which solves the problem of batch and automated testing for chip parameters with ultra-low temperature change rates(below 5ppm/℃)in chip ATE testing.After the testing is completed,synchronous testing data with the chip is provided.
作者
张洪俞
朱刚俊
董泽芳
ZHANG Hongyu;ZHU Gangjun;DONG Zefang(Nanjing Weimeng Electronics Co.,Ltd.,Jiangsu 210005,China)
出处
《集成电路应用》
2024年第3期10-12,共3页
Application of IC
关键词
集成电路
ATE测试
温度变化率
温漂
ppm/℃
芯片测试
integrated circuit
ATE testing
temperature change rate
temperature drift
ppm/℃
chip testing
