摘要
阐述光刻制程的核心工艺技术,分析各工艺步骤特点及异常情况,包括气相成底膜、涂布、前烘、曝光、曝光烘烤、显影、硬烘、检验工序,为未来进一步工艺研究与生产制造提供理论依据。
This paper describes the core process technology of photolithography,analyzes the characteristics and abnormal situations of each process step,including gas-phase film formation,coating,pre drying,exposure baking,development,hard drying,and inspection processes.It provides a theoretical basis for further process research and production manufacturing in the future.
作者
曲征辉
QU Zhenghui(Shenyang Xinyuan Microelectronics Equipment Co.,Ltd.,Liaoning 110001,China)
出处
《集成电路应用》
2024年第3期68-69,共2页
Application of IC
关键词
集成电路
光刻工艺
涂胶
显影
烘烤
integrated circuits
lithography process
gluing
development
baking