引线框架用高性能铜合金板带材及制备工艺

High-Performance Copper Alloy Plate Strip for Lead Frame and Preparation Process

电子信息产业的飞速发展,对铜及铜合金产品性能提出了更高的要求,其中集成电路封装用引线框架材料代表了铜合金板带材发展的较高水平。本文对近年来引线框架用高性能铜合金板带材及制备工艺进行了综述,介绍了国内外高性能铜合金板带材料的成分和制备加工技术及发展过程,并对其未来发展趋势进行了展望,提出未来高性能铜板带材性能将朝着抗拉强度为700 MPa、导电率为70%IACS的目标发展,其制备工艺将向着智能化、绿色化、高效化等方向发展。

With the rapid development of the electronic information industry,there is a higher demand for the performance of copper and copper alloy products,among which the lead frame material for integrated circuit packaging represents a high level of development of copper alloy plate and strip.In recent years,the high-performance copper alloy strip and its preparation process for lead frame are reviewed,the material composition,preparation and processing technology and development process of high-performance copper alloy strip at home and abroad are introduced,and the future development trend is prospected.It is proposed that in the future,the performance of high-performance copper plate and strip will develop towards the goal of IACS with tensile strength of 700MPa and conductivity of 70%,and its preparation process will develop in the direction of intelligence,greening and high efficiency.